Intel Corporation - Substrate Packaging Technology Development Equipment Engineer

Substrate Packaging Technology Development (SPTD) delivers breakthrough substrate and packaging capability and reduces substrate structural costs through innovation, increased competition, and industry standardization. The equipment engineering team drives equipment capability improvements and empowers people to support process development in SPTD's factory.

Responsibilities will include but are not limited to:

- Managing extensive equipment-based projects with many stakeholders. Examples include: correcting major safety issues, bringing equipment into regulatory compliance, planning and executing equipment repair projects (overhaul), and spearheading tool upgrades for capability, reliability, and ease of maintenance.

- Lead problem-solving efforts during factory hard-down events.

-Engage with our supply chain partners and 3rd party vendors to solve problems.

-Guide troubleshooting, execute complex repairs, and collect lessons learned.

Candidates must exhibit the below behavioral traits/skills:

- Customer Service.

-Track record of delivering safe, cost-effective, timely, and robust solutions.

- Drive collective, organizational goals over individual goals.

- Act as an engineering role model: committed to quality, empower others, available as a resource, communicate transparently, learn continuously, and foster an environment of teamwork and inclusion.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences .

Minimum Qualifications:

- Candidate must possess a BS degree with 3+ months of experience or MS degree with 6+ months of experience in science, engineering, technology, or related field.

Must have the required degree or expect the required degree by December 2022. 

Preferred Qualifications:

1+ years of experience in the following:

- Previous tool owner, shift engineer, or project manager.

- Project management experience or PMP certification.

- Plating, etching, or vacuum tool experience.

- Tool installation/qualification (IQ) experience.

- Understanding of Intel safety standards and familiarity with other industry standards, regulations, and best practices (e.g., NFPA, OSHA, SEMI, etc.).

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.